The above picture shows changes to the Wii motherboard. The Wii motherboard has been changed to fight against modchips being used in the Wii. While modchip developers claim that Wii modchips are made for legitimate backups they are often also used to illegal purposes. Therefore Nintendo is doing whatever they can do to combat modchips being installed in the Wii.

Changes to the Wii motherboard include new positioning of contacts on the motherboard(as pointed out by the three arrows in the above picture) and reducing the spaces between contact points(making it tougher to solder to the motherboard).

However the greatest problem facing chip manufacturers includes changing the chip packaging technique from TSOP, where connections are visible on the edges, to BGA where the connections are hidden underneath. This would make connections tough to reach.

This story should be considered just a simple rumor for now while we wait for some confirmation from other sources.